Chemical Vapor Deposition (CVD) Technique

Chemical Vapor Deposition (CVD) is a highly versatile and efficient technique used in materials science, particularly for supporting the growth of thin films and coatings. This process enables the deposition of pure coatings with consistent thickness and precise control over porosity, even on intricate or contoured surfaces. One of the standout features of CVD is its ability to achieve large-area deposition, making it ideal for industrial-scale applications. Additionally, selective CVD can be performed on patterned substrates, providing further customization and versatility. This method is scalable, cost-effective, and highly controllable, making it suitable for the bottom-up synthesis of various materials, particularly two-dimensional (2D) materials and thin films. These materials include metals such as silicon and tungsten, carbon-based materials like graphene and diamond, and a range of compounds including arsenides, carbides, nitrides, oxides, and transition metal dichalcogenides (TMDCs). To ensure the production of well-ordered and high-quality thin films, the use of high-purity metal precursors is essential. These precursors often include organometallic compounds, halides, alkyls, alkoxides, and ketonates, which facilitate the precise deposition of materials during the CVD process.