Microelectronics and nanoelectronics are specialized subfields within electronics focused on creating electronic components with feature sizes ranging from 100 micrometers to 0.1 micrometers (microelectronics), and 100 nanometers or smaller (nanoelectronics). The remarkable memory storage capabilities of modern electronic devices have been made possible by significantly increasing the density of microchips. By shrinking the size of field-effect transistors, more components can be integrated into a single circuit, resulting in more powerful, energy-efficient devices that are lighter and consume less power. According to Moore's Law, the number of transistors on a chip is expected to double approximately every two years, a trend that has held true since it was first predicted in 1965, driving rapid advancements in semiconductor fabrication technology. However, the pace of shrinking component dimensions is now slowing, and a significant challenge in creating electronic components in the sub-micrometer range is the design of the transistor gate, which regulates current flow through the channel. As electronic components become smaller, they also become more difficult to manufacture, as physical and quantum effects alter material properties at the nanoscale, influencing atomic interactions and quantum mechanical behaviors.
The advent of groundbreaking materials, including carbon nanotubes, boron nitride nanotubes, quantum dots, and graphene additives, has played a pivotal role in advancing the fields of nanotechnology and microtechnology. These materials possess remarkable properties that allow for the manipulation and fabrication of structures with extraordinary precision, even at the atomic scale. With these innovations, it is now possible to design and shape materials with unprecedented accuracy, enabling the development of highly advanced technologies. One of the key advances enabled by these materials is the ability to deposit and layer electronic materials with exacting precision, even down to the atomic level. This capability is fundamental to the manufacturing of next-generation semiconductor devices. Thin-film semiconductor device fabrication technologies, which utilize conducting, semiconducting, and insulating materials, offer the potential for high-volume production at extremely low costs while delivering superior performance. Modern manufacturing techniques for nanoelectronics, such as patterning (lithography), etching, thin-film deposition, and doping, have become integral to the creation of these advanced materials and devices, pushing the boundaries of what is possible in electronic manufacturing.
In addition to advancements in materials, emerging research fields in nanotechnology are exploring innovative approaches to harness the unique properties of nanomaterials and quantum mechanical effects. One such field is molecular electronics, which involves using single molecules as electronic components to establish electrical contacts with bulk-sized electrodes. This technique opens up new possibilities for miniaturization and the development of ultra-compact electronic devices. Another rapidly developing area is spintronics, or spin-transport electronics, which exploits the spin property of electrons in conjunction with magnetic and electric fields. By manipulating the spin of electrons, spintronics enables the creation of spin-polarized currents that have the potential to achieve significantly higher data transfer speeds, greater storage capacity, increased memory density, and enhanced processing power compared to traditional electronic systems that rely on electric charge alone. These advancements in molecular electronics and spintronics promise to revolutionize the way we think about and utilize electronic devices, offering more efficient and powerful alternatives to conventional technologies.