19-304-742
Foamtec UltraSOLV™ ScrubPADS™
Manufacturer: Fischer Scientific
Select a Size
| Pack Size | SKU | Availability | Price |
|---|---|---|---|
| Pack of 10 | 19-304-742-Pack-of-10 | In Stock | ₹ 45,261.24 |
19-304-742 - Pack of 10
In Stock
Quantity
1
Base Price: ₹ 45,261.24
GST (18%): ₹ 8,147.023
Total Price: ₹ 53,408.263
Product Type
Vacuum Chamber Cleaning Scrub Pad
For Use With (Application)
Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit
4000
Length (English)
4 in.
Material
Diamond
Dimensions (L x W x H)
3 x 4 in.
For Use With (Equipment)
Wafer processing tools
Includes
Without slit
Length (Metric)
10.16 cm
Thickness (English)
0.078 in.
Description
- Ideal for wafer processing tools such as LAM 9600 and 2300 Etch chambers, Hitachi Etch chambers, TEL Etch Chambers, Varian Ion Implant Process Areas, Novellus Speed, AMAT TxZ, WxZ, DxZ, SinGEN, PolyGEN, Endura and Producer CVD, PVD tools and Roth and Rau SiNX CVD tools
- Wide grit selection allows for quick removal of process-induced residue from aluminum, stainless steel, ceramic, glass, quartz and anodized surfaces while minimizing tool wear Fiber-free construction reduces particle levels in cleaned tools Unique bonding technology minimizes the release of abrasive particles leading to cleaner PM procedures Enables the elimination of H 2 O 2 from PMs, which greatly reduces recovery times
Compare Similar Items
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Product Type: Vacuum Chamber Cleaning Scrub Pad
For Use With (Application): Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit: 4000
Length (English): 4 in.
Material: Diamond
Dimensions (L x W x H): 3 x 4 in.
For Use With (Equipment): Wafer processing tools
Includes: Without slit
Length (Metric): 10.16 cm
Thickness (English): 0.078 in.
Product Type:
Vacuum Chamber Cleaning Scrub Pad
For Use With (Application):
Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit:
4000
Length (English):
4 in.
Material:
Diamond
Dimensions (L x W x H):
3 x 4 in.
For Use With (Equipment):
Wafer processing tools
Includes:
Without slit
Length (Metric):
10.16 cm
Thickness (English):
0.078 in.
Product Type: Self-wringing Sponge Mop Head
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Material: Polyurethane
Dimensions (L x W x H): __
For Use With (Equipment): __
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Length (Metric): __
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__
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Product Type: Self-wringing Sponge Mop Head
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Designed for wet mopping procedures in sterile and controlled environments
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__
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__
For Use With (Equipment):
__
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Wrapped with Polyester Lamination w/Stainless Steel Bracket
Length (Metric):
__
Thickness (English):
__