19-304-790
Foamtec UltraSOLV™ ScrubPADS™
Manufacturer: Fischer Scientific
Select a Size
| Pack Size | SKU | Availability | Price |
|---|---|---|---|
| Case of 25 | 19-304-790-Case-of-25 | In Stock | ₹ 1,07,779.00 |
19-304-790 - Case of 25
In Stock
Quantity
1
Base Price: ₹ 1,07,779.00
GST (18%): ₹ 19,400.22
Total Price: ₹ 1,27,179.22
Product Type
Vacuum Chamber Cleaning Scrub Pad
For Use With (Application)
Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit
280
Length (English)
4.25 in.
Material
Diamond
Dimensions (L x W x H)
1.5 x 4.25 in.
For Use With (Equipment)
Wafer processing tools
Includes
Without slit
Length (Metric)
10.8 cm
Thickness (English)
0.078 in.
Description
- Ideal for wafer processing tools such as LAM 9600 and 2300 Etch chambers, Hitachi Etch chambers, TEL Etch Chambers, Varian Ion Implant Process Areas, Novellus Speed, AMAT TxZ, WxZ, DxZ, SinGEN, PolyGEN, Endura and Producer CVD, PVD tools and Roth and Rau SiNX CVD tools
- Wide grit selection allows for quick removal of process-induced residue from aluminum, stainless steel, ceramic, glass, quartz and anodized surfaces while minimizing tool wear Fiber-free construction reduces particle levels in cleaned tools Unique bonding technology minimizes the release of abrasive particles leading to cleaner PM procedures Enables the elimination of H 2 O 2 from PMs, which greatly reduces recovery times
Compare Similar Items
Show Difference
Product Type: Vacuum Chamber Cleaning Scrub Pad
For Use With (Application): Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit: 280
Length (English): 4.25 in.
Material: Diamond
Dimensions (L x W x H): 1.5 x 4.25 in.
For Use With (Equipment): Wafer processing tools
Includes: Without slit
Length (Metric): 10.8 cm
Thickness (English): 0.078 in.
Product Type:
Vacuum Chamber Cleaning Scrub Pad
For Use With (Application):
Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit:
280
Length (English):
4.25 in.
Material:
Diamond
Dimensions (L x W x H):
1.5 x 4.25 in.
For Use With (Equipment):
Wafer processing tools
Includes:
Without slit
Length (Metric):
10.8 cm
Thickness (English):
0.078 in.
Product Type: Vacuum Chamber Cleaning Scrub Pad
For Use With (Application): Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit: 280
Length (English): 3.25 in.
Material: Diamond
Dimensions (L x W x H): 1.5 x 3.25 in.
For Use With (Equipment): Wafer processing tools
Includes: Without slit
Length (Metric): 8.26 cm
Thickness (English): __
Product Type:
Vacuum Chamber Cleaning Scrub Pad
For Use With (Application):
Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit:
280
Length (English):
3.25 in.
Material:
Diamond
Dimensions (L x W x H):
1.5 x 3.25 in.
For Use With (Equipment):
Wafer processing tools
Includes:
Without slit
Length (Metric):
8.26 cm
Thickness (English):
__
Product Type: Vacuum Chamber Cleaning Scrub Pad
For Use With (Application): Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit: 280
Length (English): 2.5 in.
Material: Diamond
Dimensions (L x W x H): 1.5 x 2.5 in.
For Use With (Equipment): Wafer processing tools
Includes: Without slit
Length (Metric): 6.35 cm
Thickness (English): __
Product Type:
Vacuum Chamber Cleaning Scrub Pad
For Use With (Application):
Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit:
280
Length (English):
2.5 in.
Material:
Diamond
Dimensions (L x W x H):
1.5 x 2.5 in.
For Use With (Equipment):
Wafer processing tools
Includes:
Without slit
Length (Metric):
6.35 cm
Thickness (English):
__
Product Type: Vacuum Chamber Cleaning Scrub Pad
For Use With (Application): Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit: 360
Length (English): 4.25 in.
Material: Diamond
Dimensions (L x W x H): 1.5 x 4.25 in.
For Use With (Equipment): Wafer processing tools
Includes: Without slit
Length (Metric): 10.8 cm
Thickness (English): 0.078 in.
Product Type:
Vacuum Chamber Cleaning Scrub Pad
For Use With (Application):
Quick removal of process induced residue from Aluminum, Stainless Steel, Ceramic, Glass, Quartz and Anodized surfaces while minimizing tool wear
Grit:
360
Length (English):
4.25 in.
Material:
Diamond
Dimensions (L x W x H):
1.5 x 4.25 in.
For Use With (Equipment):
Wafer processing tools
Includes:
Without slit
Length (Metric):
10.8 cm
Thickness (English):
0.078 in.