Bright electroless gold plating solution

Description

• General description: Bright electroless gold plating solution is formulated as a trouble-free gold plating solution designed to plate gold on metal parts by an electroless immersion process for printed circuit boards, transistor headers, electrical connectors, diode leads, lamps and other electronic parts. This process operates by the electroless displacement of base metals by gold, brought about by a difference in EMF potentials. Bright Electroless Gold is ready to use without modifications and will deposit gold on most common metals and alloys including copper, commercial brass, kovar, nickel, tin-lead solders, pure tin, iron and indium antimonide.
• Application: Metal parts to be plated should be thoroughly cleaned before use. The normal cleaning procedures for electroplating are adequate.Bright electroless gold plating solution will show a decrease in pH with use. The pH should not be allowed to deviate from the normal conditions for plating since inferior deposits result. Adjustment of pH can be conveniently accomplished by the addition of small amounts of ammonium hydroxide to raise pH or citric acid to lower it.The recommended plating temperature is 90 °C maximum for most metals. However, for tin-lead solders and pure tin, an optimum temperature of 50 °C is recommended.
• Features and Benefits: Features:Economical gold platingPlates bright gold on copper, kovar, brass, nickel, tin-lead solders and indium antimonideExcellent solution stabilityOperates with simple control of plating solutionReady-to-use - no mixing required